Bonding Agents
Futurabond M , Dual Cure Activator, 1518, 1/Each
589321
A flexible and reliable solution that can be applied with or without phosphoric acid etchant that is suitable for direct and indirect restorations. Ideal for zirconium, aluminum oxide, and silicate ceramics without the need for additional primer. 35-secon
CLEARFIL Universal Bond Quick 2, Bottle, Standard Kit
588293
CLEARFIL Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers that form a thin, strong adhesive layer with no waiting time. The combination significantly improves the strength of the bonding layer.
Contains:
CLEARFIL Universal Bond Quick 2, Bottle, Value Pack, 4044KA, 3/Each
588296
CLEARFIL Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers that form a thin, strong adhesive layer with no waiting time. The combination significantly improves the strength of the bonding layer.
CLEARFIL Universal Bond Quick 2, Bottle, Refill, 4042KA, 1/Each
588294
CLEARFIL Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers that form a thin, strong adhesive layer with no waiting time. The combination significantly improves the strength of the bonding layer.
CLEARFIL Universal Bond Quick 2, Unit Dose, Value Pack, 4047KA, 100/Each
588298
CLEARFIL Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers that form a thin, strong adhesive layer with no waiting time. The combination significantly improves the strength of the bonding layer.
CLEARFIL Universal Bond Quick 2, Unit Dose, Standard Pack, 4046KA, 50/Each
588297
CLEARFIL Universal Bond Quick 2 includes the original MDP combined with unique AMIDE and new UTM monomers that form a thin, strong adhesive layer with no waiting time. The combination significantly improves the strength of the bonding layer.
Adhese 100, Self-Etch Adhesive, 6g Bottle
580146
Direct-placed, light-curing composite and compomer restorations. Direct-placed, core buildups with light-, self- and dual-curing composites.
